低温无铅锡膏(低卤型及无卤型)
Indium5.5LT & NC-SMQ81 is an air refl ow, halogen-free, no-clean
solder paste designed for assembly processes using the eutectic
Sn/Bi and Sn/Bi/Ag alloys. This paste is a moderate residue product
with exceptional wetting capabilities. The low activation temperature of
Indium5.5LT & NC-SMQ81, in combination with the Sn/Bi alloy, can be
especially useful as a low temperature, Pb-Free solution.