Indium 8.9 无铅锡膏
Indium8.9 is an air refl ow, no-clean solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and refl ow requirements, this paste offers superb wetting to Pb-Free metallizations and low voiding on CSP’s with microvia-in-pad designs.
8.9 产品规格文件
8.9E产品规格文件
8.9MSDS下载
8.9E MSDS下载
8.9 产品规格文件
8.9E产品规格文件
8.9MSDS下载
8.9E MSDS下载