Flip-Chip Flux WS-688
Flip-Chip Flux WS-688 is a NIA halogen-free water
washable flip-chip dipping flux which has an activator
system powerful enough to promote wetting on the
most demanding substrate metallizations. WS-688
reduces or eliminates flip-chip voids, even in
applications where damage to the solder bump, or
traces of oxide on the solder bump or solder on pad,
can generate voids in the final flip-chip joint.
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washable flip-chip dipping flux which has an activator
system powerful enough to promote wetting on the
most demanding substrate metallizations. WS-688
reduces or eliminates flip-chip voids, even in
applications where damage to the solder bump, or
traces of oxide on the solder bump or solder on pad,
can generate voids in the final flip-chip joint.
下載PDF檔