Indium 3.2 水洗無鉛低鹵錫膏
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag and Sn/Sb Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and suffi cient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and refl ow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fi ne-pitch components, including BGA's and CSP's.
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產品資料下載
MSDS英文版下載
MSDS簡體中文版下載