LED TACFlux 007
LED TACFlux® 007 is the leading die-attach flux
for the light-emitting diode (LED) industry.
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Flip-Chip Flux WS-688
Flip-Chip Flux WS-688 is a NIA halogen-free water
washable flip-chip dipping flux which has an activator
system powerful enough to promote wetting on the
most demanding substrate metallizations. WS-688
reduces or eliminates flip-chip voids, even in
applications where damage to the solder bump, or
traces of oxide on the solder bump or solder on pad,
can generate voids in the final flip-chip joint.
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washable flip-chip dipping flux which has an activator
system powerful enough to promote wetting on the
most demanding substrate metallizations. WS-688
reduces or eliminates flip-chip voids, even in
applications where damage to the solder bump, or
traces of oxide on the solder bump or solder on pad,
can generate voids in the final flip-chip joint.
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低温无铅锡膏(低卤型及无卤型)
Indium5.5LT & NC-SMQ81 is an air refl ow, halogen-free, no-clean
solder paste designed for assembly processes using the eutectic
Sn/Bi and Sn/Bi/Ag alloys. This paste is a moderate residue product
with exceptional wetting capabilities. The low activation temperature of
Indium5.5LT & NC-SMQ81, in combination with the Sn/Bi alloy, can be
especially useful as a low temperature, Pb-Free solution.
无铅无卤锡丝
CW-801 wire solder is cored with a high reliability
no-clean flux that is compatible with Indium's full line
of Pb-Free soldering materials. It provides excellent
solder spread with minimal smoking and low odor. The
fast wetting speed is beneficial in minimizing rework cycle
time which is typically longer with Pb-Free solders.
Indium 3.2 水洗无铅低卤锡膏
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag and Sn/Sb Pb-Free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and suffi cient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and refl ow requirements, this solder paste offers superb wetting to the various Pb-Free metallizations and has exceptional low voiding performance on fi ne-pitch components, including BGA's and CSP's.
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Indium 8.9 无铅锡膏
Indium8.9 is an air refl ow, no-clean solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and refl ow requirements, this paste offers superb wetting to Pb-Free metallizations and low voiding on CSP’s with microvia-in-pad designs.
8.9 产品规格文件
8.9E产品规格文件
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8.9 产品规格文件
8.9E产品规格文件
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